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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input Data Selectors/Multiplexers
High-Performance Silicon-Gate CMOS
The MC54/74HC157A is identical in pinout to the LS157. The device inputs are compatible with standard CMOS outputs; with pullup resistors, they are compatible with LSTTL outputs. This device routes 2 nibbles (A or B) to a single port (Y) as determined by the Select input. The data is presented at the outputs in noninverted form. A high level on the Output Enable input sets all four Y outputs to a low level. The HC157A is similar in function to the HC257 which has 3-state outputs. * * * * * * Output Drive Capability: 10 LSTTL Loads Outputs Directly Interface to CMOS, NMOS, and TTL Operating Voltage Range: 2.0 to 6.0 V Low Input Current: 1.0 A High Noise Immunity Characteristic of CMOS Devices In Compliance with the Requirements Defined by JEDEC Standard No. 7A * Chip Complexity: 82 FETs or 20.5 Equivalent Gates
MC54/74HC157A
J SUFFIX CERAMIC PACKAGE CASE 620-10
1
16
16 1
N SUFFIX PLASTIC PACKAGE CASE 648-08 D SUFFIX SOIC PACKAGE CASE 751B-05 DT SUFFIX TSSOP PACKAGE CASE 948F-01
16 1
16 1
ORDERING INFORMATION MC54HCXXXAJ MC74HCXXXAN MC74HCXXXAD MC74HCXXXADT Ceramic Plastic SOIC TSSOP
LOGIC DIAGRAM
2 5 11 14 4 3 6 10 13 7 9 12 Y0 Y1 Y2 Y3 DATA OUTPUTS
A0 NIBBLE A INPUTS A1 A2 A3 B0 NIBBLE B INPUTS B1 B2 B3
PIN ASSIGNMENT
SELECT A0 B0 Y0 A1 B1 Y1 GND 1 15 PIN 16 = VCC PIN 8 = GND 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC OUTPUT ENABLE A3 B3 Y3 A2 B2 Y2
SELECT OUTPUT ENABLE
FUNCTION TABLE
Inputs Output Enable H L L Select X L H Outputs Y0 - Y3 L A0 - A3 B0 - B3
X = don't care A0 - A3, B0 - B3 = the levels of the respective Data-Word Inputs.
2/97
(c) Motorola, Inc. 1997
1
REV 7
MC54/74HC157A
II I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIII IIIIIIIIIIIIIIIIIIIIIII I I II I I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I III I I I I I I II I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIII IIIIIIIIIIIIIIIIIIIIIII I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I III I I I I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIII III I IIII II I I IIIIIIIIIIIIIIIIIIIIIII III I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII III III II I I I IIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII III I IIIIIIIIIIIIIIIIIIIIIII III III I I II IIIIIIIIIIIIIIIIIIIIIII III I I IIIIIIIIIIIIIIIIIIIIIII III II I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIII I I
II I I I I I I I IIIIIIIIIIIIIIIIIIIIIII II IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIII I I III I I I I I II IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I III I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIII I I IIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIII
MAXIMUM RATINGS*
Symbol VCC Vin Parameter Value Unit V V V DC Supply Voltage (Referenced to GND) DC Input Voltage (Referenced to GND) - 0.5 to + 7.0 - 0.5 to VCC + 0.5 - 0.5 to VCC + 0.5 20 25 50 750 500 450 Vout Iin DC Output Voltage (Referenced to GND) DC Input Current, per Pin mA mA mA Iout DC Output Current, per Pin ICC PD DC Supply Current, VCC and GND Pins Power Dissipation in Still Air, Plastic or Ceramic DIP SOIC Package TSSOP Package Storage Temperature mW Tstg TL - 65 to + 150 260 300
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or VCC). Unused outputs must be left open.
v
v
_C _C
Lead Temperature, 1 mm from Case for 10 Seconds (Plastic DIP, SOIC or TSSOP Package) (Ceramic DIP)
* Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating Conditions. Derating -- Plastic DIP: - 10 mW/_C from 65_ to 125_C Ceramic DIP: - 10 mW/_C from 100_ to 125_C SOIC Package: - 7 mW/_C from 65_ to 125_C TSSOP Package: - 6.1 mW/_C from 65_ to 125_C For high frequency or heavy load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol VCC Parameter
Min 2.0 0
Max 6.0
Unit V V
DC Supply Voltage (Referenced to GND) DC Input Voltage, Output Voltage (Referenced to GND)
Vin, Vout TA
VCC
Operating Temperature, All Package Types Input Rise and Fall Time (Figure 1)
- 55 0 0 0
+ 125III _C 1000 500 400 ns
tr, tf
VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol VIH
Parameter
Test Conditions
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 4.5 6.0 3.0 4.5 6.0
- 55 to 25_C 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9
v 85_C v 125_C
1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 1.5 2.1 3.15 4.2 0.5 0.9 1.35 1.8 1.9 4.4 5.9 2.2 3.7 5.2
Unit V
Minimum High-Level Input Voltage
Vout = VCC - 0.1 V |Iout| 20 A
v v v
VIL
Maximum Low-Level Input Voltage
Vout = 0.1 V |Iout| 20 A
V
VOH
Minimum High-Level Output Voltage
Vin = VIH |Iout| 20 A Vin = VIH
V
|Iout| |Iout| |Iout|
v 2.4 mA v 6.0 mA v 7.8 mA
2.48 3.98 5.48
2.34 3.84 5.34
MOTOROLA
2
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC157A
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
II I I I III I I I I I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIII IIIIIIIIIIIIIIIIIIIIIII I II I II I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII III I I I I I I II I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I III I I I I I I II I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I IIIIIIIIIIIIIIIIIIIIII I I II I I I I IIIIIIIIIIII II I I III I I I I I I II I I I II I I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I I I I I II I I I II I I II I I I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I III I I I I I I II I I II I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I II IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII II I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII I I II I I I IIIIIIIIIII I I I II I I I IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIIIIIIIIIII IIIIIIIIIIIIIIIIIIIIIII I I I
Guaranteed Limit Symbol VOL Parameter Test Conditions VCC V 2.0 4.5 6.0 3.0 4.5 6.0 6.0 6.0 - 55 to 25_C 0.1 0.1 0.1
v 85_C v 125_C
0.1 0.1 0.1 0.1 0.1 0.1 0.4 0.4 0.4 0.33 0.33 0.33
Unit V
Maximum Low-Level Output Voltage
Vin = VIL |Iout| 20 A
v
Vin = VIL
Iin IOZ
Maximum Input Leakage Current Maximum Three-State Leakage Current Maximum Quiescent Supply Current (per Package)
|Iout| |Iout| |Iout| Vin = VCC or GND
v 2.4 mA v 6.0 mA v 7.8 mA
0.26 0.26 0.26
0.1 0.5
1.0 5.0
1.0 10
A A
ICC
Output in High-Impedance State Vin = VIL or VIH Vout = VCC or GND Vin = VCC or GND Iout = 0 A
6.0
4.0
40
160
A
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6.0 ns)
Guaranteed Limit
Symbol S bl tPLH, tPHL
Parameter P
VCC V 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 2.0 3.0 4.5 6.0 --
- 55 to 25_C 105 65 21 18 110 70 22 19
v 85_C v 125_C
130 85 26 22 140 90 28 24 125 80 25 21 95 32 19 16 10 160 115 32 27 165 115 33 28 150 110 30 26 110 36 22 19 10
Unit Ui ns
Maximum Propagation Delay, Input A or B to Output Y (Figures 1 and 4)
tPLH, tPHL
Maximum Propagation Delay, Select to Output Y (Figures 2 and 4)
ns
tPLH, tPHL
Maximum Propagation Delay, Output Enable to Output Y (Figures 3 and 4)
100 60 20 17 75 27 15 13 10
ns
tTLH, tTHL
Maximum Output Transition Time, Any Output (Figures 1 and 4)
ns
Cin
Maximum Input Capacitance
pF
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the Motorola High- Speed CMOS Data Book (DL129/D). Typical @ 25C, VCC = 5.0 V 33
CPD
P i )* Power Di i i C Dissipation Capacitance (P Package)* (Per P k
F pF
* Used to determine the no-load dynamic power consumption: P D = C PD V CC 2 f + I CC V CC . For load considerations, see Chapter 2 of the Motorola High-Speed CMOS Data Book (DL129/D).
High-Speed CMOS Logic Data DL129 -- Rev 6
3
MOTOROLA
MC54/74HC157A
PIN DESCRIPTIONS
INPUTS A0, A1, A2, A3 (Pins 2, 5, 11, 14) Nibble A inputs. The data present on these pins is transferred to the outputs when the Select input is at a low level and the Output Enable input is at a low level. The data is presented to the outputs in noninverted form. B0, B1, B2, B3 (Pins 3, 6, 10, 13) Nibble B inputs. The data present on these pins is transferred to the outputs when the Select input is at a high level and the Output Enable input is at a low level. The data is presented to the outputs in noninverted form. OUTPUTS Y0, Y1, Y2, Y3 (Pins 4, 7, 9, 12) Data outputs. The selected input Nibble is presented at these outputs when the Output Enable input is at a low level. The data present on these pins is in its noninverted form. For the Output Enable input at a high level, the outputs are at a low level. CONTROL INPUTS Select (Pin 1) Nibble select. This input determines the data word to be transferred to the outputs. A low level on this input selects the A inputs and a high level selects the B inputs. Output Enable (Pin 15) Output Enable input. A low level on this input allows the selected input data to be presented at the outputs. A high level on this input sets all outputs to a low level.
SWITCHING WAVEFORMS
tr INPUT A OR B tPLH OUTPUT Y tTLH 90% 50% 10% tTHL 90% 50% 10% tPHL tf tr VCC SELECT GND tPLH OUTPUT Y 90% 50% 10% tTLH tTHL 90% 50% 10% tPHL tf VCC GND
Figure 1. HC157A
tr OUTPUT ENABLE tPHL OUTPUT Y tTHL 90% 50% 10% 90% 50% 10% tf
Figure 2. Y versus Select, Noninverted
VCC GND tPLH
tTLH
Figure 3. HC157A
TEST POINT OUTPUT DEVICE UNDER TEST CL*
* Includes all probe and jig capacitance
Figure 4. Test Circuit
MOTOROLA
4
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC157A
EXPANDED LOGIC DIAGRAM
2 A0 B0 A1 B1 NIBBLE OUTPUTS A2 B2 A3 B3 OUTPUT ENABLE SELECT 10 14 13 15 1 12 Y3 9 Y2 3 5 6 11 7 Y1 DATA OUTPUTS 4 Y0
High-Speed CMOS Logic Data DL129 -- Rev 6
5
MOTOROLA
MC54/74HC157A
OUTLINE DIMENSIONS
-A -
16 9
J SUFFIX CERAMIC PACKAGE CASE 620-10 ISSUE V
-B - C L
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIM F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. INCHES MIN MAX 0.750 0.785 0.240 0.295 -- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 15 0 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 -- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 15 0 1.01 0.51
-T
SEATING - PLANE
N E F G D 16 PL 0.25 (0.010)
M
K M J 16 PL 0.25 (0.010)
M
TB
S
TA
S
DIM A B C D E F G J K L M N
-A -
16 9
N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R
B
1
8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MILLIMETERS MIN MAX MIN MAX 0.740 0.770 18.80 19.55 0.250 0.270 6.35 6.85 0.145 0.175 3.69 4.44 0.015 0.021 0.39 0.53 0.040 0.070 1.77 1.02 0.100 BSC 2.54 BSC 0.050 BSC 1.27 BSC 0.008 0.015 0.21 0.38 0.110 0.130 2.80 3.30 0.295 0.305 7.50 7.74 0 10 0 10 0.020 0.040 0.51 1.01
F S
C
L
-T - H G D 16 PL 0.25 (0.010)
M
SEATING PLANE
K
J TA
M
M
-A -
16 9
D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J
-B -
1 8
P 8 PL 0.25 (0.010)
M
B
M
G F
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 4.00 3.80 1.75 1.35 0.49 0.35 1.25 0.40 1.27 BSC 0.25 0.19 0.25 0.10 7 0 6.20 5.80 0.50 0.25 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019
K C -T SEATING -
PLANE
R X 45
M D 16 PL 0.25 (0.010)
M
J
T
B
S
A
S
MOTOROLA
6
High-Speed CMOS Logic Data DL129 -- Rev 6
MC54/74HC157A
OUTLINE DIMENSIONS
DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948F-01 ISSUE O
16X K REF
0.10 (0.004) 0.15 (0.006) T U
S
M
TU
S
V
S
K K1
16
2X
L/2
J1 B -U-
L
PIN 1 IDENT. 1 8
SECTION N-N J
N 0.25 (0.010) 0.15 (0.006) T U
S
A -V- N F DETAIL E
M
DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 4.90 5.10 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.18 0.28 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.193 0.200 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.007 0.011 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_
C 0.10 (0.004) -T- SEATING
PLANE
H D G
DETAIL E
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High-Speed CMOS Logic Data DL129 -- Rev 6
7
EE CC EE CC
9
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-.
-W-
MC74HC157A/D MOTOROLA


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